Hionix offers in house dry and wet oxidation services for 2" - 18" diameter wafers.
Hionix has a library of recipes for thermal oxide processes and has implemented hardware modifications to deliver the highest quality films with extremely low contaminants and minimal particle counts.
Wet Oxidation :
2k A - 20 k Å with wafer within wafer non uniformity of ± 5% range and target thickness tolerance of ± 10%
Dry Oxidation :
500A - 3k Å with wafer within wafer uniformity of ± 10% range and target thickness tolerance of ± 10%.
Hionix also offers annealing services at atmosphere/in inert environment.