• Phone: (408) 526 2333

PVD Films

Hionix chooses in-house coating technologies, to deliver specific film capabilities and best combination of performance, physical characteristics and cost savings to meet our customer needs.

Hionix can deposit films on a wide variety of substrates, and sizes:

Substrates

Size (mm)

Thickness

Type

Minimum

Maximum

Minimum

Maximum

Silicon

25

450

100um

3mm

GaAs/ InP

50

200

150um

1mm

Glass

25x25

550x550

30um

3mm

Polymer

25x25

550x550

30um

3mm

PCB

10x10

550x550

200um

3mm

Molded

25x25

550x550

200um

3mm



  • Hionix has resources for a monthly capacity of 10,000 wafers (volume depends on process type).

  • Standard production lead-time is less than 10 days for a majority of services. R&D project lead-times may be longer depending upon complexity.

Below are some of our available films/targets. However, note that we are constantly procuring new targets and developing new films.Please contact us directly if your requested film is not listed.



200mm wafers and smaller ­

Ag

AlSiCu

CoFe

In

NiCu

Ru

Sn

TiN

Al

Au

Cr

Mo

NiV

RuO2

SnZn

TiW

AlCu

AZO

Cu

Mn

NeFeCr

Si

SS

TiO2

AlN

Bi

CuMn

MnN

Nb

SiC

Ta

W

Al2O3

BiTe

Hf

Ni

NbO2

SiGe

TaN

Zn

AlSi

C

HfO2

NiCr

Pt

SiO2

Ta2O5

Zr

AlTAZr

Co

ITO

NiFe

Quartz

Si3N4

Ti

ZrO2





300mm wafers and larger ­

Ag

C

CuGa

Mo

Ru

Si3N4

TiO2

Al

Ce

CuMn

Ni

RuO2

SS

TiW

AlCu

CoTaZr

FeNiCr

NiFe

Si

Ta

W

AlN

Co

Hf

NiSi

SiC

TaN

Zn

AlSi

CoFe

HfO2

NiTi

SiGe

Ta2O5

 

Al2O3

Cr

Mn

NiMo

SiN

Ti

 

AZO

Cu

MnN

NiV

SiO2

TiN