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PVD & Equipment

Thin Film Deposition is the technology of applying a very thin film of material – between a few nanometers to about 100 micrometers. Thin Film Deposition manufacturing processes are at the heart of today’s semiconductor, solar panel, CD, disk drive, and optical device industries. We have in house tools capable of thin film deposition using D-source magnetron sputtering technology. Magnetron Sputtering is a Physical Vapor Deposition(PVD) process in which a plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or "target". The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target.

Magnetic materials sputtering:

  • High strength magnetic array is required for magnetron to saturate the target material and have flux to confine electrons to sustaining plasma
  • Design of the magnetron is a challenge for achieving full face erosion, uniformity and target life time

Magnetic materials sputtering

Reactive sputter deposition:

  • Reactive gas, typically, N2 or O2 introduced to chamber during deposition to deposit nitrides or oxides or oxynitrides
  • Usually done with RF or pulsed DC
  • Chemical reaction takes place on substrate
  • Pressure management critical for a good reactive process control of stoichiometry, stress

Reactive sputter deposition

Tango Systems, Inc. has been manufacturing and marketing PVD systems based on the technology developed at Hionix. Tango Systems provides sputtering systems to advanced packaging, discrete and compound semiconductor industries, and uses Hionix as their customer demonstration and process technology development laboratory.

Tango Axcela Pre­Clean and Sputter for wafer sizes 2” and up to 450mm 

Tango Topaz Pre­Clean and Sputter for panel sizes up to 650x650mm