- ResMap Four point Probe, made by Creative Design Engineering (CDE), is a semiautomatic tool to measure the sheet resistance of a thin film or the bulk resistance of a wafer/sample.
- The wafer/sample is manually loaded onto the probe platform. Measurements are automatically controlled according to the selected recipe that is preprogrammed.
- It is capable of accommodating a wafer up to 12 inches in diameter. The maximum number of measurement sites available is 99, and the measurement pattern can be circular, rectangular, linear along the diameter of the wafer, or in a customized geometry.
- The measurement range is from 2 mΩ/□ to 5MΩ/□ with 0.5% accuracy.
- Film measurement screenshot provided to show thickness and Rs data for the sample i.e. average, range and standard deviation (1sig/3sig values).
FSM / 128 series:
- Provides 2D wafer stress map, wafer bow, etc
- Laser Scanning technology is used to measure the radius of curvature and bow of wafers where a laser beam is directed to the wafer.
- Simplest and most widely adopted technique in film stress and wafer bow measurement.
- The beam is reflected at an angle that corresponds to the radius of curvature of the wafer.
- Film stress is calculated from the difference in radius of curvature, i.e. wafer bow, measured before and after deposition of the film.
- Measures 40 data points/mm, > 10k points / 300 mm scan.
- The Filmetrics F50 can measure the thickness of dielectrics, semiconductors, and thin metal films for thicknesses between 100Å and 450 microns.
- Optical constants such as refractive index (n) and extinction coefficient (k) can also be measured on a variety of dielectric films.
- Commonly measured films include:
- semiconductor process films such as oxides, nitrides, resists, and polysilicon
- optical coatings such as hardness and antireflection coatings
- flat panel display films such as polyimides, resist, and cell gaps
- Various coatings used in CD and DVD manufacture.
- Films that cannot be measured include very rough films and opaque dielectric films.
- Hitachi S4700 series, a Cold Field Emission Gun Scanning Electron Microscope (CFESEM), it combines the versatility of PC control with a novel electron optical column to give exceptional performance on large and small specimens.
- The S4700 also offers excellent low kV performance with guaranteed resolution of ~ 10 nm at 1 kV, at a working distance of 56mm.
- There are two secondary electron detectors; one above the objective lens, the other below. Available image mode include secondary electron image.
- Images provide key qualification data to reliably measure field layer thickness and step coverage.
- Load lock size: 150 mm
- Traverse :
- X: 0 - 100 mm
- Y: 0 - 50 mm
- Z: 1.5 - 30 mm